Western Digital

The Programme 

We thrive on the power and potential of diversity. As a global company, we believe that the most effective way to embrace the diversity of our customers and communities is to mirror it from within. 

Western Digital has long been at the forefront of game changing innovations. From the invention of the first hard drive to recent advancements in 3D NAND our journey of innovation continues to inspire those who dare to think big. 

Wherever you are, Western Digital is with you every step of the way. We are always at the cusp of innovation, pushing the boundaries of technology to make what you thought was once impossible, possible. 

What You Will Do

• 与跨团队合作，对SIP封装产品进行早期风险评估和设计优化，确保最可行的设计和***的DFX 应用于最终产品 
• 定义封装设计NUDDs，并与工艺/产品开发团队合作，为未来产品的应用启动必要的新技术开发项目 
• 主持设计、工艺和产品等相关问题的深入讨论，以解决关键产品需求，并推动解决方案，加速新产品的上市时间 
• 与团队合作，通过模拟和可行性研究降低设计风险
• 与IT团队合作进行系统开发，包括定义工作手册(SOW)、项目开发、用户验收测试(UAT), 并提供培训  

Required Skills and Abilities 

• 机械或材料工程专业硕士或博士学位 
• 具有丰富的半导体封装设计知识 
• 优秀的协调能力，能够与跨职能团队有效合作 
• 英语熟练，有较强的表达和沟通能力 
• 具备多任务处理能力，能在紧迫的期限内完成任务，抗压能力强